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戴雷

作者: 时间:2025-03-22 浏览次数:


一、个人基本情况

戴雷,男,汉族,博士,副教授,国家自然科学基金评审专家,《Journal of Alloy and Compound(SCI核心,JCR二区)国际期刊审稿人。2012年获天津大学博士学位,2013年进入三峡大学任教。目前主持国家自然科学基金项目2项,湖北省自然科学基金1项。近年来以第一作者发表SCI学术论文20余篇,获授权发明专利10项。


、科研

代表性论文

[1] Lei Dai, Zhong Liu, Liming Yu,Yongchang Liu*, Zengmin Shi,Microstructural characterization of Mg–Al–O rich nanophase strengthened Fe–Cr alloys,Mater. Sci. Eng. A, 771: 138664, 2020

[2] Lei Dai, QianyingGuo, Yongchang Liu*, Liming Yu, Huijun Li, Structure and tensile properties of Fe-Cr model alloy strengthened by nano-scale NbC particles derived from controlled crystallization of Nb-rich clusters, Mater. Sci. Eng. A, 674: 579~587, 2016

[3] Lei Dai, Yongchang Liu*, Zhizhong Dong, Liming Yu, Formation mechanism of nanoscale oxide particles in mechanically milled Fe-Cr oxide-dispersion-strengthened steels, Sci. Adv. Mater, 4: 851~858, 2012

[4] Yongchang Liu*Lei Dai, Formation of nanoscale oxide particles and evaluation of threshold stress of Fe-9Cr-0.2Ti-0.3Y2O3 nano-structured ferritic alloy, Mater.Sci.Forum, 745-746:398-406,2013
[5] Lei Dai, Yongchang Liu*, Zhizhong Dong, Liming Yu, Phase transformation kinetics from ferrite to austenite in Fe-Cr ODS ferrite steels, Sci. Adv. Mater, 4: 869~876, 2012

[5] Lei Dai, Yongchang Liu*, Zhizhong Dong, Liming Yu, Microstructural evolution of oxide-dispersion-strengthened Fe-Cr model steels during mechanical milling and subsequent hot pressing, J. Mater. Sci, 48: 1826~1836, 2013

[6] Lei Dai, Yongchang Liu*, Ping Feng, Jun Zhao, Microstructural evolution of MgAl2O4 oxide-dispersion-strengthened alloy by mechanical milling and hot isostatic pressing, J. Mater. Res, 29: 1440~1447, 2014

[7] Lei Dai, Ping Feng, Caihua, Huang, Guangwei Zhao, Preparation of Y-Ti bioxides strengthened Fe-Cr alloy by mechanical milling and hot pressing, Appl. Mech. Mater, 475-476:1307~1310,2014
[9]Lei Dai, Yongchang Liu*, Zhizhong Dong, Liming Yu, Size and structure evolution of yttria in ODS ferritic alloy powder during mechanical milling and subsequent annealing, Powder Tech,217:281-287,2012


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